Silicon ingot resin diamond grinding wheel

Silicon ingot resin diamond grinding wheel uses resin bond, high quality diamond abrasive, used for chamfering polycrystalline silicon block grinding surface. Common specifications 260 * 38 * 60 granularity 100-200 #, 250 * 38 * 60 600-1000 # suitable for Japanese BBS and other monocrystalline silicon polysilicon integrated machine.